Alumina dispersion strengthened copper alloy (ODS & Al2O3-Cu) is graded C15715, C15740 and C15760. They consist of a pure copper matrix containing finely dispersed sub-microscopic particles of Al203 which act as a barrier to dislocation movement. The dispersed Al2O3 is thermally stable so that it acts to retard recrystallization of copper. Consequently, significant softening does not occur as the result of high temperature exposure. Along with superior strength retention, thermal and electrical conductivities are higher than conventional copper alloys.

1. Electronic components: remains hard even after brazed
2. Contact material: as a contact it remains hard at high temperatures and does not weld.
3. Reinforcing: washers in high temperature heat sinks
4. Spot welding electrodes: welding for titanium, galvanized steel, stainless steel, copper, nickel, aluminum alloy, aluminum brass, steel and other metallic materials.